STUDY OF COPPER GALVANIZATION PROCESS IN ALUMINUM ALLOY 6063

Sulejmani, Liridon (2021) STUDY OF COPPER GALVANIZATION PROCESS IN ALUMINUM ALLOY 6063. Journal of Natural Sciences and Mathematics of UT, 6 (11-12). pp. 162-172. ISSN 2671-3039

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Abstract

Electrical conductivity, resistance to thermal expansion, metallic brightness and electrodeposition efficiency makes copper very suitable and beneficial for electroplating. Extensive industrial application of aluminium alloy 6063 is a serious reason for studying the galvanizing process of this alloy with copper. In this work, we have studied the mass of electrodeposited copper and its thickness in five samples of aluminium alloy 6063 which have undergone the galvanizing process. The galvanizing process is performed for different time intervals 20 min, 40 min, 50 min, 60 min and 80 min, respectively. Masses of the samples of aluminium alloy were measured before and after galvanizing with a technical scale. The thickness of electrodeposited copper in different samples was defined from photographs obtained with a metallurgical optical microscope with magnification 500X. For the electrolysis process samples were prepared with abrasive papers while for optical microscope observation was used a polishing machine. The solution used for the electrolysis process was copper (II) sulfate pentahydrate. The methods used during the work of this paper have been: electroplating, metallographic specimen preparation and optical microscopy. The key process of this work is a galvanizing process while the main law by which galvanizing process takes place is Faraday’s first law of electrolysis. We expect are that copper deposition in aluminium alloy samples will take place according to Faraday’s law respectively the mass and the thickness of copper deposits will be in direct proportion with current flow time.

Item Type: Article
Subjects: Q Science > QC Physics
Divisions: Faculty of Engineering, Science and Mathematics > School of Physics
Depositing User: Unnamed user with email zshi@unite.edu.mk
Date Deposited: 01 Sep 2021 11:32
Last Modified: 01 Sep 2021 11:32
URI: http://eprints.unite.edu.mk/id/eprint/732

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